Thermally transferable type emblem made of thermoplastic synthetic resin and method of manufacturing the same

ABSTRACT

There is provided a thermal transfer type emblem made of thermoplastic synthetic resin comprising three-dimensional design elements made of a flexible thermoplastic synthetic resin sheet as well as a method of manufacturing the same. Design elements formed with a design printed in color on the surface are bonded to the underside of a carrier film and a hot-melt type film is bonded to the lower surface of each of said design elements. If necessary, a synthetic resin adhesive layer is provided therebetween and said hot-melt type film may be bonded to a sheet of releasing paper at the underside. By appropriately selecting materials for the hot-melt type film and the synthetic resin adhesive layer, the flexible and three-dimensional emblem can be so made as to firmly adhere to an object by simply pressing the emblem with an iron regardless of the material of the object.

This is a Division of application Ser. No. 08/439,885 filed May 12,1995, now U.S. Pat. No. 5,599,416, which is a Divisional application ofSer. No. 08/151,110 filed Nov. 12, 1993, now U.S. Pat. No. 5,520,988.

BACKGROUND OF THE INVENTION

This invention relates to a thermally transferable type emblem orornamental decoration piece made of a thermoplastic synthetic resin tobe suitably used to apply a design by heating and pressing it on thesurface of an object such as clothing, bags, sports or office equipment,stationery made of fiber, textile, synthetic resin, leather, metal, etc.

It is known in JP-A-2 145320 to prepare an ornamental design product orpiece such as an emblem, a sticker or the like byhigh-frequency-induction heating flexible thermoplastic synthetic resin.

As disclosed by JP-B-57 60160, it is also known to produce a flexiblethermoplastic synthetic resin emblem in the form of a relief design on afabric by means of high frequency induction heating and the produceddesign is then transferred onto an object also by means ofhigh-frequency-induction-heating.

However, an ornamental design product according to the above JP-A-2145320 requires its base portion to be sawed or bonded with adhesiveonto the surface of an object such as a piece of clothing, and thus cannot give an aesthetically unsatisfactory appearance to those who see itwhile it is not particularly convenient to be put on the objectdepending on the location thereof if the object has a complicatedprofile.

The method disclosed in said JP-B-57 60160 requires a step oftransferring the object from a processing plant where the object isproduced, to another plant where the design transferring operation iscarried out by the high-frequency-induction-heating, and then returningthe object to the processing plant, so as to require enormous cost,labor and time for transportation and keeping the object undercontrolled conditions.

Such inconvenience is remarkable particularly when a component of apiece of clothing is independently sent to a facility where anornamental design product is fitted thereto and the fitted product isfound defective, because all the remaining components of that piece ofclothing become useless.

Additionally, there may be cases where objects onto which a design of anemblem is to be transferred are not compatible withhigh-frequency-induction-heating.

Embroidered ornamental design products and metal ornamental designproducts carrying hot melt adhesive on the back side are also known.However, there has not been proposed any thermal transfer typethermoplastic synthetic resin emblem that does not includes a base of afabric or a synthetic resin sheet and that carries only hot meltadhesive attached to the back side of each of the elements of the designof the emblem that are three-dimensionally formed from a flexiblethermoplastic synthetic resin sheet.

SUMMARY OF THE INVENTION

Therefore an object of the present invention is to provide a thermallytransferable type thermoplastic synthetic resin emblem carrying a designwhich is three-dimensionally formed from a flexible thermoplasticsynthetic resin sheet and can be transferred on an object by simpleheating and pressing means regardless of the material of the object aswell as a method of manufacturing such emblems.

According to the first aspect of tile invention, the above object isachieved by providing a thermally transferable type emblem made ofthermoplastic synthetic resin comprising: a three-dimensional designelement (10) made of a thermoplastic synthetic resin sheet and cut alongrespective contours (11), said design element (10) being formed with athree-dimensional design; a hot-melt type film (13) bonded to saiddesign elements (10) and having a contour corresponding to the contours(11) of the design elements (10); and a transparent carrier film (7)stickily adhered to the upper surface of the design element (10), saidcarrier film (7) being more resistive to heat than said design element(10) and the hot-melt type film (13).

Preferably, the emblem further comprises a sheet of releasing paper (14)bonded to the lower surface of said hot-melt type film (13). Also,preferably, the carrier film (7) is stickily adhered to the uppersurface of the design element (10) by means of tacky adhesive (8). Ifthe design element (10) is not directly bonded to the hot-melt type film(13), the emblem further comprising a synthetic resin adhesive layer(12) disposed under said design elements (10) and also cut along thecontours (11) of the design elements, said a hot-melt type film (13)being bonded to said design elements (10) with said synthetic resinadhesive layer (12), and said carrier film (7) being more resistive tosaid heat than synthetic resin adhesive layer (12).

According to the second aspect of time invention, the above object isachieved by providing a method of manufacturing a thermally transferabletype emblem made of thermoplastic synthetic resin, comprising the stepsof: (a) placing a hot-melt type film (18) on a pole plate (16) of anelectrode die for high-frequency-induction, (b) laying a thermoplasticsynthetic resin sheet (10) formed with design thereon on said thehot-melt type film (13), (c) stickily bonding a transparent carrier film(7) on the upper surface of said thermoplastic synthetic resin sheet(10) to produce a multilayer structure, said transparent carrier film(7) being more resistive to heat than said hot-melt type film (18) andsaid thermoplastic synthetic resin sheet (10); (d) melting and cuttingsaid hot-melt type film (18) and said thermoplastic synthetic resinsheet (10) of said multilayer structure along design contours (11) bypressing an engraving die (18) thereon and applying a high frequencywave thereto to produce three-dimensional design elements; (e) coolingsaid multilayer structure, (f) removing unnecessary portions of saidmultilayer structure other than said design elements (10).

Preferably, said hot-melt type film (13) is stickily adhered with areleasing paper (14) on the backside thereof; after the step (e), thereleasing paper (14) is removed; and after the step (f), the releasingpaper (14) is again bonded to the exposed backside of said hot-melt typefilm (13). If the emblem includes a synthetic resin adhesive layer (12)disposed under said design elements (10), the method further comprising;after the step (a), laying a synthetic resin adhesive sheet (17) on thesurface of said hot-melt type film (13), said synthetic resin adhesivesheet (17) being capable of adhering to both said film (11) and saidthermoplastic synthetic resin sheet (10); and in the step (b), layingsaid thermoplastic synthetic resin sheet (10) on said synthetic resinadhesive sheet (17).

An emblem according to the first aspect of the invention can be firmlybonded onto an object simply by placing it appropriately on the objectand heating and pressing it from the top or the underside of the objectwith an iron, a heat press machine and the like.

Therefore, according to the emblem of the present invention, it is notnecessary to transfer an object such as clothing, sports equipment froma plant of manufacturing the object to the other plant (having anelectrode die for high-frequency-induction) of applying an emblem of theprior art in order to apply or bond the emblem to the object, and toreturn the object with the emblem to the plant of manufacturing theobject. Thus, according to the present invention, it is merely necessaryto transfer the object from the plant of manufacturing the emblem to theplant of manufacturing the object.

The emblem according to the present invention can be applied orthermally transferred to an object such as a clothing, a bag, a sportsequipment, an office equipment, a stationery etc. The hot-melt type filmto be used for the emblem according to the present invention may be madeof a material suitable for the material of the object. If the designlayer and the hot-melt type film are not bonded very well, the syntheticresin adhesive layer capable of strongly adhering to both the designlayer and the hot-melt type film may be additionally arrangedtherebetween. With such synthetic resin adhesive layer, the emblem canbe easily applied or thermally transferred to the object by simplyheating and pressing the emblem.

Since the upper surface of the design layer having a lot of designelements is stickily adhered to the carrier film by means of tacky orstick adhesive, the design elements may be transferred and accuratelypositioned onto the surface of an object in a single operation, even ifthe design elements are isolated from each other.

Since the carrier film of an emblem according to the invention istransparent, the design of the emblem is always visible and can becorrectly placed in position for thermal transfer operation.

Additionally, since the design of an emblem according to the inventionis not formed on a thick base as in the case of, a conventionalembroidered ornamental design product or a conventional emblem made ofsynthetic resin, the design components made of flexible thermoplasticsynthetic resin of the present invention can be directly bonded onto theobject so as not to damage the appearance (aesthetic satisfaction) ofthe object with the emblem, and so as to freely select the position ofthe emblem in the object.

According to the second aspect of the invention, the hot-melt type filmdepending on the material of the object, the flexible thermoplasticsynthetic resin sheet for forming the design and a carrier film having amelting point higher than those of the above materials are selected. Ifnecessary, a synthetic resin adhesive sheet capable of firmly bondingthe hot-melt type film and the flexible thermoplastic synthetic resinsheet is selected. Then, the hot-melt type film (with a releasing paper,if necessary) is placed on a pole plate of an electrode die forhigh-frequency-induction. Then, the synthetic resin adhesive sheet isplaced onto the hot-melt type film, if necessary. The flexiblethermoplastic synthetic resin sheet printed with a design is placed ontothe synthetic resin adhesive sheet or hot-melt type film. Then, thecarrier film is placed onto the flexible thermoplastic synthetic resin.

Then, in the second step, the multilayer structure thus obtained ispressed by an engraving die while a high frequency wave is appliedthereto to cut the film and sheets and to form the three-dimensionaldesign elements on the flexible thermoplastic synthetic resin.

Because of the heat resistivity of the carrier film, the carrier film isnot molten nor cut by the engraving die in the second step.

After removing the processed multilayer structure from the pole plateand cooling it, in the third step, the sheet of releasing paper ispeeled off from the backside of the hot-melt type film, if necessary.Then, the unnecessary portions (in other words, the portion except thedesign) of the multilayer structure are removed by means of, forexample, tweezers. If necessary, the sheet of releasing paper is bondedagain to the back side of the hot-melt type film to complete theoperation of producing an emblem according to the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic plan view of a preferred embodiment of theinvention.

FIG. 2 is an enlarged schematic sectional view cut along X--X line ofFIG. 1.

FIG. 3 is an enlarged schematic sectional view, showing the process ofmanufacturing an emblem according to the invention.

DESCRIPTION OF THE PREFERRED EMBODIMENT

FIGS. 1 and 2 schematically illustrate a preferred embodiment of thefirst aspect of the present invention. In the illustrated embodiment,the emblem carries a design 6 composed of a number of design elements 1,2, 3, 4 and 5.

The design elements 1, 2, 3, 4 and 5 are bonded to a carrier film 7 of apolypropylene sheet with tacky adhesive 8.

Although the design elements 1 through 5 are differently shaped, theyhave the same three-dimensional structure (the same sectional structure)and therefore only the element 1 will be described hereinafter.

As shown in FIG. 2 with enlarged dimensions, the design element 1includes a design layer 10 of a flexible thermoplastic synthetic resinwhich has a given three-dimensional form (design) 9. In the preferredembodiment, the design layer 10 is made of polyurethane sheets and analuminum foil (not shown) sanded therebetween. The layer 10 is cut alonga contour 11 of the design element 1 by heat-melting. In the illustratedembodiment, a given pattern is printed in color on the surface of thepolyurethane sheet 10.

Said design element 1 is then bonded onto a hot-melt type film layer 13,which is made of polyamides in this embodiment, by means of a syntheticresin adhesive layer 12 arranged therebetween. The layer 12 is made of athermosetting resin in this embodiment. Said synthetic resin adhesivelayer 12 and said hot-melt type film layer 18 having a contour same asthat of the design element 1.

Then, the lover surface of the hot-melt type layer 13 is bonded with asheet of releasing paper 14 to produce a complete emblem or decorationpiece 15 in this embodiment.

The layer 12 may be omitted, if unnecessary. On the other hand, anotherlayer may be added, for example, two hot-melt type film layers may beprovided and a layer for avoiding an invasion of a die may be providedbetween the hot-melt type film layers. The invention is not limited tothe illustrated embodiment.

The emblem 15 illustrated in FIGS. 1 and 2 is prepared by means of anapparatus schematically illustrated in FIG. 3, by the method comprisingthe steps as described below.

In the first step, the hot-melt type film layer 13 and the sheet ofreleasing paper 14 bonded onto the lover surface of the layer 13 areplaced on a pole plate 16 of an electrode die forhigh-frequency-induction, which is not shown in FIG. 3.

The hot-melt type film layer 13 is preferably made of polyamides havinga melting point of 120° C., if the emblem is used for a fabric productand subjected to dry cleaning and/or ironing operations, in other words,the emblem requires high temperature resistance. If the emblem is usedto bond it onto a synthetic leather such as urethanes, vinyl chlorides,the hot-melt type film layer 13 is preferably made of polyurethaneshaving a melting point of approximately 100° C. If the emblem is used tobond it onto a plastic material such as polyester, polyvinyl chloride,polycarbonate, or a metal such as iron, copper or aluminum, the hot-melttype film layer 13 is preferably made of polyesters having a meltingpoint of around 120° C. If the emblem is designed as a general type thatmay be used of a wide variety of materials including wood, metal andfiber, the hot-melt type film layer 13 is preferably made of an EVAhaving a melting point of 83° C. If the emblem is used for an objectmade of hard vinyl chloride, the hot-melt type film layer 13 ispreferably made of an EVA having a melting point of 100° C.

Then, a synthetic resin adhesive sheet 17 is superposed on the surfaceof said hot-melt type film layer 13. The synthetic resin adhesive sheet17 forms the synthetic resin adhesive layer 12 and firmly bonds thedesign layer 10 and the hot-melt type film layer 13. The adhesive sheet17 may be made of polyurethane, heat setting synthetic resin or amoisture-setting synthetic resin.

Thereafter, the flexible thermoplastic synthetic resin layer 10 of thedesign element 1 is superposed on the surface of said synthetic resinadhesive sheet 17. The thermoplastic synthetic resin layer 10 is formedwith a design such as a printed pattern, letter, symbol, color and thelike. The thermoplastic synthetic resin layer 10 is made of a flexiblethermoplastic synthetic resin such as polyurethane, vinyl chloride.

In this stage of operation, a thin and foamed sheet of thermoplasticsynthetic resin may be interposed between the design layer 10 and thesynthetic resin adhesive sheet 17. Other materials and sheets may beinterposed between the design layer 10 and the synthetic resin adhesivesheet 17, if necessary.

Then, a transparent carrier film 7 is laid and bonded on the uppersurface of the design layer to with a sticky adhesive layer 8.

The carrier film 7 is made of a material, such as polypropylene, havinga melting point higher than those of the hot-melt type film layer 13,the synthetic resin adhesive sheet 17 and the design layer 10, and henceresistive to heat.

The sticky adhesive layer 8 should be made of a material that may notpermeate into the design layer 10.

After laying a number of layers on the pole plate 16 in the abovedescribed first step, an engraving die or cutter-mold 18 presses againstthe multilayer structure along the direction as indicated by arrow Pand, at this time, a high frequency wave is applied to it from a highfrequency induction heater (not shown).

The engraving die 18 has a processing surface which is provided with afusion cutter 20 having a plan view corresponding to the contour 11 ofthe design element 10 to be formed and a design area 21 where a designis engraved. Thus, since the engraving die 18 presses the multilayerstructure and a high frequency wave is applied thereto, the design layer10, the synthetic resin adhesive sheet 17 and the hot-melt type filmlayer 13 are molten and cut along the contour 11 of the design element 1to produce a three-dimensional form (design) 9 in the contour 11.

In this operation, since the carrier film 7 and the releasing paper 14are more resistive to heat than the other layers, they are neithermolten nor cut.

The design element thus formed with the three-dimensional design isremoved from the polar plate 16 and cooled. Then, in the third step, thereleasing paper 14 is peeled off and an unnecessary portions 22, 23 ofthe materials as indicated in FIGS. 1 and 2 are removed by, for example,using tweezers. Then, the releasing paper 14 is bonded again to thelower surface of the hot-melt type film layer 13 of the design elements1 to complete the preparation of the emblem 15.

When using, in other words, the emblem or decoration piece thus obtainedis thermally transferred to the surface of an object such as a piece ofclothing, sports or office equipment or stationery, the releasing paper14 is peeled off from the emblem 15, which is then placed in position onthe object and pressed against the object at a temperature between 100°and 160° C. under a pressure between about 0.1 kg/cm² and 3 kg/cm² for aperiod between 0.5 and 5 seconds by means of a heat press or an irondepending on the thermal characteristics of the hot-melt type film layer13 involved, to thermally transfer the design onto the object. After theemblem element 15 is cooled, the carrier film 7 is removed to completethe operation of thermally transferring the design of the emblem 15.

When transferring the design of the emblem 15 to the object, it ispreferable to heat and press the object that receives the design fromthe other side thereof,but the emblem 15 may be heated and presseddirectly against the object depending on the type of the design and thatof the object.

With an emblem according to the invention, the operation of transferringthe emblem can be carried out simply by heating and pressing it onto theobject because the emblem can be placed easily and correctly in positionas it is seen through the transparent carrier film.

The present invention is advantageous in that only a simple electrodedie for high-frequency-induction is required as equipment formanufacturing emblems and the manufactured emblems can be used withoutmassive equipment in a plant that manufactures products for receivingthe design of the emblems. So, the present invention can enormously savelabor and cost in a plant that uses emblems to print designs on theproducts it manufactures as no electrode die forhigh-frequency-induction is required there nor the products do not needto be moved to and from a facility where such an apparatus is installed.

Since the hot-melt type layer can be made of a material that is suitedto the object onto which the design of the emblem is transferred,allowing an emblem according to the invention to have a vide variety ofapplications.

Since a number of design elements are bonded to a single carrier film inan emblem according to the invention, the design elements do not losethe proper arrangement even if they are isolated from each other.

Since the design elements are not carried by a thick fabric or a thicksynthetic resin sheet and the design of the emblem is directly andthree-dimensionally put on the surface of the object, an emblemaccording to the invention provides an enhanced degree of freedom ofdesign for the designer.

Since the hot-melt type layer may be made of a material suited to theobject onto which the design of the emblem is transferred, and since thematerial for the synthetic resin adhesive sheet may be so selected as tobe suited to bond the hot-melt type layer and the design elements madeof a flexible thermoplastic synthetic resin, an emblem according to theinvention may be allowed to have a wide variety of applications from theview point of the material of the object.

Since an emblem according to the invention is prepared by arranging anumber of film layers on a hard pole plate and using an engraving dieand high frequency induction heating, fine and exquisitethree-dimensional patterns may be reliably formed as compared withconventional emblems that are normally formed on a thick fabric or athick synthetic resin sheet.

What is claimed is:
 1. A thermally transferrable emblem made ofthermoplastic synthetic resin comprising:a single three-dimensionaldesign element made of a flexible thermoplastic synthetic resin sheetand cut along respective contours, said design element being formed witha three-dimensional design; a hot-melt film having an upper surface anda lower surface, said upper surface bonded to a lower surface of saiddesign element and having a contour corresponding to the contours of thedesign element; and a transparent carrier film removably adhered to anupper surface of the design element, said carrier film being moreresistive to heat than said design element and the hot-melt film.
 2. Athermally transferrable emblem according to claim 1, further comprisinga sheet of releasing paper bonded to the lower surface of said hot-meltfilm.
 3. A thermally transferrable emblem according to claim 1, whereinthe carrier film is removably adhered to the upper surface of the designelement by means of tacky adhesive.
 4. A thermally transferrable emblemaccording to claim 1, further comprising a synthetic resin adhesivelayer disposed under said design element and also cut along the contoursof the design element,said hot-melt film being bonded to said designelement with said synthetic resin adhesive layer, and said carrier filmbeing more resistive to said heat than said synthetic resin adhesivelayer.
 5. A thermally transferrable emblem according to claim 4, furthercomprising a foamed sheet of thermoplastic synthetic resin interposedbetween said design element and said synthetic resin adhesive layer. 6.A thermally transferrable emblem according to claim 1, wherein saidsingle three-dimensional design element is the only three-dimensionaldesign element in said thermally transferrable emblem.